Manufacturer for Copper Tape Emi Shielding - EMI Shielding Film with Good Shielding – Lucky Innovative
Manufacturer for Copper Tape Emi Shielding - EMI Shielding Film with Good Shielding – Lucky Innovative
Manufacturer for Copper Tape Emi Shielding - EMI Shielding Film with Good Shielding – Lucky Innovative Detail:
Product Description
EMI Shielding Film is mainly used in FPC which consist of Modules for mobile phones,PC,medical devices,digital cameras,automotive instruments,etc.
Product Availability
LKES-800
LKES-1000
LEKS-6000
Product Features
(1) Good processing characteristics
(2) Good electrical conductivity
(3) Good shielding properties
(4) Good heat resistance
(5) Environmental friendly (Halogen free, meet requirements of RoHS Directives and REACH, etc.)
Product Structure
Product Characteristics
LKES -800
| Item | Test Data | Test standard or Test method |
| Thickness (Before Lamination, μm) | 16±10% | Enterprise Standard |
| Thickness (After Lamination, μm) | 13±10% | Enterprise Standard |
| Ground Resistance(Gold plated, φ 1.0mm, 1.0cm, Ω) | <1.0 | JIS C5016 1994-7.1 |
| Peeling strength of reinforced film (N/25mm) | <0.3 | Enterprise Standard |
| Lead-free Soldering Reflow (MAX 265℃) | No stratification; No foaming | JIS C6471 1995-9.3 |
| Solder (288℃, 10s, 3 times) | No stratification; No foaming | JIS C6471 1995-9.3 |
| Shielding Properties(dB) | >50 | GB/T 30142-2013 |
| Surface Resistance（mΩ/□） | ＜350 | Four Terminal Method |
| Flame Retardant | VTM-0 | UL94 |
| Printing Character | PASS | JIS K5600 |
| Glossiness(60°, Gs) | ＜20 | GB9754-88 |
| Chemical resistance(Acid,alkali and OSP) | PASS | JIS C6471 1995-9.2 |
| Adhesion to Stiffener (N/cm) | ＞4 | IPC-TM-650 2.4.9 |
LKES-1000
| Item | Test Data | Test standard or Test method |
| Thickness (After Lamination, μm) | 14-18 | Enterprise Standard |
| Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
| Surface Insulation | ≥200 | Enterprise Standard |
| Adhesive Fastness(Hundred cells test) | No cell fall off | JIS C 6471 1995-8.1 |
| Resistant to Alcohol Wipe | 50 Times no damage | Enterprise Standard |
| Scratch Resistance | 5 times no Leakage of metal | Enterprise Standard |
| Ground Resistance, (Gold plating, φ 1.0mm, 1.0cm, Ω) | ≤1.0 | JIS C5016 1994-7.1 |
| Lead-free Soldering Reflow (MAX 265℃) | No stratification; No foaming | JIS C6471 1995-9.3 |
| Solder (288℃, 10s, 3 times) | No stratification; No foaming | JIS C6471 1995-9.3 |
| Printing Character | PASS | JIS K5600 |
LKES-6000
| Item | Test Data | Test standard or Test method |
| Thickness (After Lamination, μm) | 13±10% | Enterprise Standard |
| Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
| Ground Resistance, (Gold plated, φ 1.0mm, 1.0cm, Ω) | ≤0.5 | JIS C5016 1994-7.1 |
| Ground Resistance, (Gold plated, φ 1.0mm, 3.0cm, Ω) | 0.20 | JIS C5016 1994-7.1 |
| Release force (N/cm) | <0.3 | Enterprise Standard |
| Surface Insulation（mΩ） | ≥200 | Enterprise Standard |
| Adhesive Fastness(Hundred cell test) | No cell fall off | JIS C 6471 1995-8.1 |
| Lead-free Soldering Reflow (MAX 265℃) | No stratification; No foaming | JIS C6471 1995-9.3 |
| Solder (288℃, 10s, 3 times) | No stratification; No foaming | JIS C6471 1995-9.3 |
| Flame Retardant | VTM-0 | UL94 |
| Printing Character | PASS | JIS K5600 |
Recommended Processing Condition
| Lamination Method | Lamination condition | Solidification condition | |||
|
Temperature(℃) |
Pressure(kg) |
Time (s) |
Temperature (℃) |
Time(min) |
|
| Quick- Lamination | LKES800/6000:180±10LKES1000:175±5 | 100-120 | 80-120 | 160±10 | 30-60 |
Note:Customer can adjust the technology based on the real condition when processing.
（1）Peel off protection layer first, and then bond to FPC, 80℃ Heating table can be used for pre bonding.
（2）Laminate in accordance with the above process, take out, and then peel off the carrier film after cooling.
（3）Solidification process.
Packing
（1） Standard Specification of product: 250mm×100m.
（2）After removing static electricity, the products are packed in aluminum foil paper and also put drier in it.
（3） Outside is packed in paper cartons and fixed to ensure the safety of products during transportation and handling, and avoid damage.
Storage and Attention
（1）Recommended Storage Condition
Temperature: (0-10)℃; Humidity: below 70%RH
（2）Attention
（2.1）Please do not open the outside package and balance the shielding film at room temperature for 6 hours before using to reduce the effect of frost and dew on the shielding film.
（2.2）Suggest to be used as soon as possible after take out from the cold storage, in case of quality changing under the normal temperature for long time .
（2.3） This product is not resistant to water phase sealing agent and flux, if having the above processing technology, please test and confirm first.
（2.4） Suggest quick lamination, vacuum laminating needs to be tested and confirmed.
（2.5）Quality guarantee period under the above condition is 6 months.
Product detail pictures:
Related Product Guide:
As for aggressive price ranges, we believe that you will be searching far and wide for anything that can beat us. We can easily state with absolute certainty that for such high-quality at such price ranges we're the lowest around for Manufacturer for Copper Tape Emi Shielding - EMI Shielding Film with Good Shielding – Lucky Innovative , The product will supply to all over the world, such as: Kuwait , Swiss , Slovak Republic , Our products have enjoyed a great reputation for their good quality, competitive prices and prompt shipment in international market. Presently, we are sincerely looking forward to cooperating with more overseas customers based on mutual benefits.
By Michaelia
from Liverpool
- 2018.04.25 16:46
With a positive attitude of "regard the market, regard the custom, regard the science", the company works actively to do research and development. Hope we have a future business relationships and achieving mutual success.
By Kitty
from Buenos Aires
- 2018.09.21 11:44
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